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1st ACM SIGSOFT International Workshop on Testing Embedded and Cyber-Physical Systems (TECPS 2017), July 13, 2017, Santa Barbara, CA, USA

TECPS 2017 – Proceedings

Contents - Abstracts - Authors

1st ACM SIGSOFT International Workshop on Testing Embedded and Cyber-Physical Systems (TECPS 2017)

Title Page
Article: isstaws17tecpsforeword-fm000-p doi:

Message from the Organizers
Article: isstaws17tecpsforeword-fm001-p doi:

Discovering Instructions for Robust Binary-Level Coverage Criteria
Vaibhav Sharma, Taejoon Byun, Stephen McCamant, Sanjai Rayadurgam, and Mats P. E. Heimdahl
(University of Minnesota, USA)
Article: isstaws17tecpsmain-tecpsmainid7-p doi:

Testing Uncertainty of Cyber-Physical Systems in IoT Cloud Infrastructures: Combining Model-Driven Engineering and Elastic Execution
Hong-Linh Truong and Luca Berardinelli
(Vienna University of Technology, Austria)
Article: isstaws17tecpsmain-tecpsmainid1-p doi:

Fault Injection in the Internet of Things Applications
Mohammad Amin Alipour
(University of Houston, USA)
Article: isstaws17tecpsmain-tecpsmainid5-p doi:

Towards Automated Composition of Heterogeneous Tests for Cyber-Physical Systems
Alex Groce, Paul Flikkema, and Josie Holmes
(Northern Arizona University, USA; Pennsylvania State University, USA)
Article: isstaws17tecpsmain-tecpsmainid3-p doi:

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