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1st ACM SIGSOFT International Workshop on Testing Embedded and Cyber-Physical Systems (TECPS 2017), July 13, 2017,
Santa Barbara, CA, USA
1st ACM SIGSOFT International Workshop on Testing Embedded and Cyber-Physical Systems (TECPS 2017)
Frontmatter
Papers
Discovering Instructions for Robust Binary-Level Coverage Criteria
Vaibhav Sharma,
Taejoon Byun,
Stephen McCamant,
Sanjai Rayadurgam, and
Mats P. E. Heimdahl
(University of Minnesota, USA)
@InProceedings{TECPS17p1,
author = {Vaibhav Sharma and Taejoon Byun and Stephen McCamant and Sanjai Rayadurgam and Mats P. E. Heimdahl},
title = {Discovering Instructions for Robust Binary-Level Coverage Criteria},
booktitle = {Proc.\ TECPS},
publisher = {ACM},
pages = {1-0},
doi = {},
year = {2017},
}
Fault Injection in the Internet of Things Applications
Mohammad Amin Alipour
(University of Houston, USA)
@InProceedings{TECPS17p9,
author = {Mohammad Amin Alipour},
title = {Fault Injection in the Internet of Things Applications},
booktitle = {Proc.\ TECPS},
publisher = {ACM},
pages = {9-8},
doi = {},
year = {2017},
}
Towards Automated Composition of Heterogeneous Tests for Cyber-Physical Systems
Alex Groce,
Paul Flikkema, and
Josie Holmes
(Northern Arizona University, USA; Pennsylvania State University, USA)
@InProceedings{TECPS17p13,
author = {Alex Groce and Paul Flikkema and Josie Holmes},
title = {Towards Automated Composition of Heterogeneous Tests for Cyber-Physical Systems},
booktitle = {Proc.\ TECPS},
publisher = {ACM},
pages = {13-12},
doi = {},
year = {2017},
}
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