VEE 2022
18th ACM SIGPLAN/SIGOPS International Conference on Virtual Execution Environments (VEE 2022)
Powered by
Conference Publishing Consulting

18th ACM SIGPLAN/SIGOPS International Conference on Virtual Execution Environments (VEE 2022), March 1, 2022, Virtual, Switzerland

VEE 2022 – Proceedings

Contents - Abstracts - Authors

Frontmatter

Title Page
Welcome from the Chairs
VEE 2022 Organization

Keynotes

In Pursuit of a Trusted Computing Base: The Journey through Virtualization (Keynote)
Haibo Chen ORCID logo
(Shanghai Jiao Tong University, China)
Publisher's Version
Virtual Programming Environments: Programming the Cloud (Keynote)
David Grove ORCID logo
(IBM Research, USA)
Publisher's Version

Papers

Portkey: Hypervisor-Assisted Container Migration in Nested Cloud Environments
Chandra Prakash, Debadatta Mishra, Purushottam Kulkarni, and Umesh Bellur
(IIT Bombay, India; IIT Kanpur, India)
Publisher's Version
Container-Aware I/O Stack: Bridging the Gap between Container Storage Drivers and Solid State Devices
Song Wu ORCID logo, Zhuo Huang, Pengfei Chen, Hao Fan, Shadi Ibrahim ORCID logo, and Hai Jin ORCID logo
(Huazhong University of Science and Technology, China; Inria, France)
Publisher's Version
ClusterRR: A Record and Replay Framework for Virtual Machine Cluster
Wei Wang, Zhiyu Hao, and Lei Cui
(Institute of Information Engineering at Chinese Academy of Sciences, China; University of Chinese Academy of Sciences, China)
Publisher's Version
EOP: Efficient Operator Partition for Deep Learning Inference over Edge Servers
Yuanjia Xu ORCID logo, Heng Wu ORCID logo, Wenbo Zhang ORCID logo, and Yi Hu ORCID logo
(University of Chinese Academy of Sciences, China; Institute of Software at Chinese Academy of Sciences, China; Nanjing Institute of Software Technology, China)
Publisher's Version
Enabling Pipeline Parallelism in Heterogeneous Managed Runtime Environments via Batch Processing
Florin Blanaru, Athanasios Stratikopoulos, Juan Fumero, and Christos Kotselidis
(University of Manchester, UK)
Publisher's Version
Transparent and Lightweight Object Placement for Managed Workloads atop Hybrid Memories
Zhe Li and Mingyu Wu ORCID logo
(Shanghai Jiao Tong University, China)
Publisher's Version
Capability Boehm: Challenges and Opportunities for Garbage Collection with Capability Hardware
Dejice Jacob ORCID logo and Jeremy SingerORCID logo
(University of Glasgow, UK)
Publisher's Version Info

proc time: 4.18